PANTA© SMD / SMD R | SUMIDA flexible connections

PANTA^© SMD / SMD R

The PANTA SMD SYSTEM is specially designed for use in automated assembly. It offers the user a wide range of placement options in electronic device manufacturing, even in difficult mounting situations.

SMD components are a reliable and robust connection technology, which is suitable for all standard placement techniques. In addition, they allow a very dense assembly of the printed circuit board.

Features

Widespread use in automotive and industrial electronics and medical technology
Fulfills part accuracy and tolerance requirements for standard pick-and-place machines
Temperature resistance up to -40°C up to 125°C
Current rating 1-2 A
Vibration resistance
Meets cleanliness requirements according to ISO 16232 and VDA 19.1
Processing following standard soldering profiles according to DIN EN 61760-1 / J-STD-020
Final assembly of the connected printed circuit boards of up to 180° possible

Customer benefits

Cost savings due to automatic placement
Reliable connection technology
Cost-effective alternative to rigid-flex printed circuit boards
Reliable alternative to step-milled circuit boards
Realization of special installation space situations
Miniaturization, significant reduction in the size of circuits and devices due to smaller component dimensions
Improvement of the production quality

Technical data

Order Code	SMD		SMD R
Pitch (mm)	0,5	0,93	1,0	1,27
Number of pins max.	8 bis 32 **	4 bis 25	4 bis 16	4 bis 16
Bridging length (mm)	11,2	11,2	20 - 40	20 - 40
Total length (mm)	15,2	15,2	22 - 42	22 - 42
Coplanarity (μm)	100	150	150	150
Insulation material (foil)	Polyimid	Polyimid	Aramid	Aramid
Conductor material (mm)	Cu 0,1	Cu 0,15	Cu Ø 0,254	Cu Ø 0,32
Surface	NiSn	Sn / NiSn	NiSn	Sn / NiSn***
Rated voltage V_DC	30	60	200	200
Current rating at 20 °C A (to DIN EN 60512-5-2)	1	2	1,8	2,2
Operating temperature (°C)	-40°C bis +125°C	-40°C bis +125°C	-40°C bis +125°C	-40°C bis +125°C
Flammability	UL 94 V-0	UL 94 V-0	UL 94 V-0	UL 94 V-0

^{*simulates //}^{** Larger on request //}^{*** on request}

_{We reserve the right to make changes in the interest of technical progress and further development.}

Footprint

Order Code	SMD		SMD R
Pitch	0,5	0,93	1,0	1,27
Min. bending radius (mm)	2,0	2,0	2,0	2,0
Max. Bending change	5 x 180°	5 x 180°	50 x 180°	50 x 180°
Recommended reflow profile PB free MSL	DIN EN 61760-1 J-STD-020 Level 1
Reflow cycles (max.)	2	2	1	1
Packaging (ESD)	IEC 60268-3 EIA-481-E
Storage period from delivery date	6 months 10°C to 40°C 40% to 60% rel. H.	6 months 10°C to 40°C 40% to 60% rel. H.	6 months 10°C to 40°C 40% to 60% rel. H.	6 months 10°C to 40°C 40% to 60% rel. H.