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The wire diameter is the main criteria to match the current capability. Please select the right size depending on your current requirement as mentioned on the data sheet table. The pitch of conductors will go up as your current requirement increases. Packaging and ambient temperatures should also be taken into account (see Derating)
Do you require a connectable, disconnectable or permanent connection? Length, mechanical and electrical requirements, number of conductors and the prefered manufacturing technology (THT - through hole or SMT - Surface mount) are key aspects to define the right product. For more details please visit our area FBC (Flexible Board Connections) on our homepage or contact our customer service.
ZIF-Jumper could be applied for mateable connections together with the related ZIF connectores (from e.g. Molex, FCI, Tyco, JST, Iriso, Hirose, etc.). An alternative is the product group PANTA FIX CRIMP. It is possible to assemble terminals and connectores (e.g. Tyco, Nicomatic, Pancon, Lumberg...) on one or both sides of the flex jumper.
Pitches from 0,5mm on are possible depending on the product group. See further details for the Flexible Board Connections (FBC) types. Special pitches are available upon request.
The possible insulation length could vary depending on the product group. For special lenghts please get in contact with our customer support.
Depending on the product type different bridging length are possible. Please contact our customer service for support.
It is possible to apply printing (plain text), Barcode and Data Matrix Code. Please contact our customer service for further information.
Beside the catalogue type products we also offer customer specific solutions. Please contact us!
Derating results of our flatwires, FFC and Jumpers are available upon demand. Please contact our customer service.
Polyester, PEN, Nomex ©, und Polyimid (Kapton) could be used as lamination materials.
ZIF-Jumper does have UL 20896 (Pitch ≤ 0,5mm) and UL 20706 (Pitch > 0,5mm).
We typically use copper bare or tinned. For ZIF Jumpers we could offer gold plating or other special surfaces based on your specification. On request we can offer special surface coating to avoid wiskers.
Pitch 0,5 mm = 50 V, Pitch 1,0 + 1,25 +1,27, 2,0 = 200 V, Pitch > 2,5 = 300 V
Polyester -40° C to 105° C;
PEN, Nomex and Polyimid (Kapton) - 40° C to 125° C
Standard connection systems for flat cables are usually unsealed. Special requirements should be discussed with our customer service.
The chemical resistance of the flat cables have to be checked based on your specification. Please contact our customer service for support.
Up to 5 Mio. bending cycles are possible depending on the wire and foil dimensions. Please contact our customer service for support.
For higher current demands we would advise to use the PANTA FIX POWER with up to 8 Amp per conductor. Derating information is available on request.
Those are not in the standard portfolio. Please contact our customer service for such special requirements.
The FLL-Jumper can be applied with hot bar soldering and similar methodes.
The possible bending radius depends on the product type and the number of required bending cycles. Please contact our customer service for questions.
Soldering, Welding, ZIF and LIF, Connection Systems, IDC (Insulation Displacement Connection), etc.
The proposed soldering temperature is based on the characteristics of the insulation material and the used adhesive system. Tell us your specific requirement. Our customer service will review it and give you advice for your application.
The SMD-Jumper could be handled with Pick&Place equipment and is capable to be reflow soldered.
SMD-Jumper and Pin-in-Paste jumpers (Panta PIP Jumper) could be used with Pick&Place assembly equipment.
Blister packaging on reels is used for SMD-Jumper and PIP Jumpers. Stackable trays are also possible for specific products upon request.
Rectangular copper conductors are the basis for FFC (flexible flat cable). Those are laminated between two glue coated isolation foils. FFC's are used for straight point to point links. The width and the pitch of the conductors remains constant. A process to create a FPC (Flexible Printed Circuit) is similar to a PCB and is using a chemical etching process.
Complex structures are possible but the length is limited by the applied equipment.
Top and bottom foils join under certain pressure and temperature parameters.
Increase of ductility based on flat geometry. This results in less stress on the solder joints. Another advantage is a higher vibration performance and the prevention of conductor breackage during dynamic stress.
Customer Service and Product Management -> see contacts on our homepage.