SUMIDA flexible connections GmbH is a member of the SUMIDA CORPORATION Japan


PANTA<sup>©</sup> SMD / SMD R

The PANTA SMD SYSTEM is specially designed for use in automated assembly. It offers the user a wide range of placement options in electronic device manufacturing, even in difficult mounting situations.

SMD components are a reliable and robust connection technology, which is suitable for all standard placement techniques. In addition, they allow a very dense assembly of the printed circuit board.

  • Widespread use in automotive and industrial electronics and medical technology
  • Fulfills part accuracy and tolerance requirements for standard pick-and-place machines
  • Temperature resistance up to -40°C up to 125°C
  • Current rating 1-2 A
  • Vibration resistance
  • Meets cleanliness requirements according to ISO 16232 and VDA 19.1
  • Processing following standard soldering profiles according to DIN EN 61760-1 / J-STD-020
  • Final assembly of the connected printed circuit boards of up to 180° possible
Customer benefits
  • Cost savings due to automatic placement
  • Reliable connection technology
  • Cost-effective alternative to rigid-flex printed circuit boards
  • Reliable alternative to step-milled circuit boards
  • Realization of special installation space situations
  • Miniaturization, significant reduction in the size of circuits and devices due to smaller component dimensions
  • Improvement of the production quality


Technical data


Order CodeSMDSMD R
Pitch (mm)0,50,931,01,27
Number of pins max.8 bis 32 **4 bis 254 bis 164 bis 16
Bridging length (mm)
11,211,220 - 4020 - 40
Total length (mm)
 15,215,222 - 4222 - 42
Coplanarity (μm)100150150150

Insulation material (foil)


Conductor material (mm)

Cu 0,1Cu 0,15Cu Ø 0,254Cu Ø 0,32


NiSnSn / NiSnNiSnSn / NiSn***

Rated voltage VDC 


Current rating
at 20 °C  A
(to DIN EN 60512-5-2)

Operating temperature (°C)-40°C bis +125°C-40°C bis +125°C-40°C bis +125°C-40°C bis +125°C


UL 94 V-0UL 94 V-0UL 94 V-0UL 94 V-0

 *simulates // ** Larger on request // *** on request



 We reserve the right to make changes in the interest of technical progress and further development.



Order CodeSMDSMD R
Min. bending radius (mm)2,02,02,02,0
Max. Bending change5 x 180°5 x 180° 50 x 180° 50 x 180°
Recommended reflow profile
PB free

DIN EN 61760-1 
Level 1

Reflow cycles (max.)2211
Packaging (ESD)IEC 60268-3

Storage period
from delivery date

6 months
10°C to 40°C
40% to 60% rel. H.

6 months
10°C to 40°C
40% to 60% rel. H.
6 months
10°C to 40°C
40% to 60% rel. H.

6 months
10°C to 40°C
40% to 60% rel. H.

Footprint PDF`s at Downloads


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